Director, Engineering (Packaging)

Skyworks Solutions, Inc
parental leave, paid time off, 401(k)
United States, Iowa, Cedar Rapids
5110 N River Blvd Ne (Show on map)
Mar 31, 2025
If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution.Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates. Requisition ID:75298 Description The Director, Packaging will be responsible for driving many of the technology project activities with focus on the business unit's packaging technology roadmap, technology coordination and design methodology supporting the product development needs. The packaging responsibilities includes driving aggressive design rules, new module packaging concepts, filter packaging, and PCB technology.Technology coordination responsibilities involve interaction with foundry and sourcing for long term capacity and diversification planning.Additional responsibilities include driving Design Automation (DA) tools and IT requirements, design methodology, and custom automation. In this position you have the opportunity to make a uniquely large impact on the success of the company by working closely with multiple teams and functions throughout the organization. #LI-DB1 Responsibilities 1)Packaging: Own the BU package roadmap and represent the BU via monthly packaging/BU meetings -Technologies include LGA and Dual-Side BGA packaging with conformal shielding and assembly with SMT passives plus wire bond and flip-chip die attach Carefully coordinate and work with the packaging team on the roadmap, ensuring a clear annual platform is developed well ahead of the product developments starting Drive 20% annual size reduction efforts Carefully coordinate with Technology and Manufacturing Group (TMG) to ensure BU needs are met in a timely manner DriveTest Vehicles for builds that provide feasibility and support longer term goals 2)Technology coordination: Monthly communication of technology use status to facilitate capacity and diversity planning Maintain database of technology usage within new product developments -Technologies include 40/65/90/110nm SOI, 130/180nm Si, HBT/BiHEMT, BAW/TCSAW 3)Design automation and methodology support: Working with the Design Automation (DA) team to drive productivity and tool improvements. -Tool flows include Cadence Virtuoso/APD, Agilent ADS, EMX/HFSS Working with the Design Automation (DA) team driving decisions for toolsets within the module design flow. -Examples include 3D packaging, filter/die integration into board design, and automation via scripts 4) Development support: Proto Line development: Yield/Process evolution flow for the Proto Lines (local/NPB/SJ/NBP). - This may require tools/approaches ahead of our production facility. Ensuring local labs have build flows independent of production, but allow the flows to convert successfully into production flow Attend design meetings and work with product design teams to share with packaging the needs and evolution ProductEVB development for labs - Interface with vendors to ensure new product package requirements can be met with our vendors, identify when new stack ups, processes, vendors are needed 5)IT development support: Working with the IT team to drive data systems and tool improvements. -Systems include Agile, Sharepoint, SQL, custom internal software solutions Working with the IT team to drive implementation and use of office documentation and communication tools Required Experience and Skills BS + 15 years of Packaging Experience or MS + 12 Years or PhD + 8 Years Extensive knowledge and capability in the following: Packaging PCB technology Electrical Simulation/EM tools Design for manufacturing Financial knowledge Ability to work in a team environment Product development knowledge Semiconductor reliability & qualification understanding Product engineering Validation and test engineering The typical base pay range for this role across the U.S. is currently USD$166,600 -$333,100 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance. Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law.Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.